Die Sorting
Process Flow
Process Capabilities
Design & Development
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Assembly

We provide a full range of assembly for plastic and ceramic packages, metal cans, RF modules and power management modules. Major assembly processes include dicing, die sorting, epoxy or eutectic die attach, die coating, gold or aluminum wire bonding, resonance testing, BeO or substrate attach through furnace, plastic encapsulation, can welding, leak tests, lead finish using solder plate or solder dip, singulation and lead forming.

 

Testing

We provide final test services which include 100% DC electrical testing, 100% or sampling RF testing, laser or ink marking (branding), packing in carrier tapes, shipping tubes, trays or bulk-packed according to customers' requirements.

 

RF Testing Capabilities

We perform RF testing on discrete power devices such as power gain, return loss and efficiency. RF testing is done according to customers' test circuits and specifications.

 

Drop Shipment

We do drop shipments for our customers as a value added service to reduce the delivery time.