We provide a full range of assembly for ceramic packages, metal cans, RF modules and power management modules. Major assembly processes include dicing, die sorting, epoxy or eutectic die attach, die coating, gold or aluminum wire bonding, resonance testing, BeO or substrate attach through furnace, can welding, leak tests, lead finish using solder plate or solder dip, singulation and lead forming.
We provide final test services which include 100% DC electrical testing,
100% or sampling RF testing, laser or ink marking (branding), packing
in carrier tapes, shipping tubes, trays or bulk-packed according to